Ultrasonic Dip Soldering Equipment

Ultrasonic dip soldering is more environmentally friendly compared to traditional soldering methods. The vibration and cavitation phenomenon during ultrasonic dip soldering makes the oxide layer on the solder’s surface come off, the high-frequency vibration energy does not melt the solder, and it helps the solder wet the solder.

It helps the solder to wet the solder. It is the ideal choice for large-area coating when dip soldering. The solder is melted in a specific solder crucible equipped with an ultrasonic vibrator. As the molten solder ripples on the ultrasonic vibrating surface, the coated part is dipped. The surface cleanliness of the welded part has a significant effect on the soldering performance. It is recommended to clean the soldering surface with acetone before soldering to achieve better soldering results.

Working Principle

Ultrasonic dip welding technology is different from ultrasonic plastic welding, in which the vibration generates heat to melt the connected parts during the plastic welding process. Ultrasonic dip welding uses the basic principle, and the ultrasonic cleaning process is similar; in this process, vibration can create cavities in the water bath or cleaning solvent, submerged in a liquid medium part, subject to the strong corrosive effect of the vacuum bubbles collapsed in the liquid for cleaning.

In the ultrasonic dip welding process, a separate energy source generates heat used to melt the filler metal and then adds ultrasonic vibration energy to the molten solder used as a transmission medium for ultrasonic vibration. When high-frequency vibration energy is applied to the molten solder, ultrasonic cavitation is produced on the welded tool’s surface to break up and disperse surface oxides. The cavitation ruptures microbubbles, cleaning the solder’s surface and allowing the wet solder to bond to the pure metal.

Vibration also ensures that there are no voids in the solder joint, and the vibration energy forces liquid solder into cracks and micro vias in the substrate. It helps seal the part and increases the surface area to which the solder can bond. Ultrasonic vibration also squeezes air bubbles out of the liquid solder, so this method makes the joint suitable for high vacuum applications where an airtight seal is required.

What kinds of materials can be welded

Ultrasonic dip welding allows the welding of different materials and can be used to weld materials difficult to weld with conventional methods. Because it does not require flux, users can save time and save money on cleaning flux residue while reducing corrosion and increasing the durability of soldered joints. Tin-lead solder is typically used for soldering metals easily wetted, such as silver, copper, and nickel. Tin-silver solder is used for stainless steel, while tin-zinc and zinc-aluminum alloys are used for aluminum, and indium alloys are often used in glass-ceramics. Handheld Dip Soldering In dip soldering, the part or parts to be soldered are immersed in a bath of molten metal, and the ultrasonic transducer can be mounted on the bottom of the crucible or in direct contact with the molten metal.

Features of Ultrasonic Dip Welding

Environmentally friendly welding solution

It will not produce any chemical substances harmful to the environment and the human body. There is no water pollution and no air pollution because there is no need for flux and solvent cleaning processes.

Perfect Welding

Wuxi welding is a defect-free welded joint and does not cause corrosion of the joint due to flux.

Vibration allows the solder to penetrate tiny gaps, resulting in a perfect weld. It has robust and reliable welded joints.

Cost-saving and efficiency

Cost savings by replacing expensive copper wire with aluminum wire. Reduced equipment costs and production costs as no flux-related processes are required. A simple soldering process as no flux related process is required (high-efficiency soldering)

Support for new application development

Successful soldering of glass, ceramics, and it difficult to solder materials that are not possible in conventional soldering.